3240 epoxy board [insulation board plastic board, by the electric glass cloth dipped in epoxy resin, by drying, hot pressing.
Epoxy resin is an organic polymer compound containing two or more epoxy groups in the molecule. In addition to their individual, their relative molecular mass is not high. The molecular structure of the epoxy resin is characterized by the presence of a reactive epoxy group in the molecular chain, and the epoxy group may be at the terminal, intermediate or cyclic structure of the molecular chain.
Name meaning
Implementation of standards: GB / T1303.1-1998 (character), red, green, black for the protocol standards.
Temperature level: Class B maximum allowable temperature () 130 \ Winding temperature limit (K) 80 \ Performance reference temperature () 100
Color: true color (yellow), red, green, black, etc. (can be added color, deployed into a variety of colors)
Features: After curing the epoxy resin system has excellent mechanical properties, the temperature of the machine under the high strength, high humidity electrical stability under the good.
Electrical: After curing the epoxy resin system is a high dielectric properties, resistance to surface leakage, excellent resistance to arc insulation material
Uses: machinery, electronics, electrical use. Applicable to machinery, electrical, electronics, electrical and other fields. Also used for the processing of insulation, processed into various types of insulation accessories. Equipment insulation structure parts.
Thickness: Under normal circumstances 0.5 ~ 50mm, can also be required to produce 50 ~ 150mm thick plate.
The reaction of the epoxy resin and the curing agent used is carried out by a direct addition reaction or by ring-opening polymerization of an epoxy group in the resin molecule without the presence of water or other volatile by-products. They exhibit very low shrinkage (less than 2%) compared to unsaturated polyester resins and phenolic resins during curing.